MID BOARD OPTICAL MODULE (MBOM) PRIMARY HEAT SINK

摘要

The present invention relates to an optical module for high-speed data communications, comprising a carrier substrate (100) adapted to mount an optical device (200), and a primary heat sink (300) adapted to transfer heat produced by the optical device, wherein at least one of a first side and a second side of the primary heat sink is adapted to mount the carrier substrate thereon. In addition, the primary heat sink may include guiding structures (301,303) adapted to mate with corresponding guiding structures (106,107) provided on the carrier substrate for aligning and fixing the carrier substrate on the primary heat sink. The primary heat sink (300) may also include thermal ports (304) for establishing a thermal interface with an external heat sink (500). The primary heat sink of the present invention makes possible to significantly improve the thermal and/or mechanical interfaces of the optical module as well as density packaging.