发明名称 |
METHOD OF PRODUCING A LARGE NUMBER OF SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED, ARRANGEMENT OF A LARGE NUMBER OF SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED, AND SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED |
摘要 |
A method of producing a multiplicity of surface-mountable carrier devices includes: A) providing a carrier plate having a first main face and a second main face located opposite the first main face, B) applying an electrically conductive layer to the first main face, C) applying a solder resist mask to a side of the electrically conductive layer remote from the carrier plate, wherein a multiplicity of adjoining regions are formed on the electrically conductive layer by the solder resist mask, D) applying a solder material to the solder resist mask and the electrically conductive layer, wherein the solder resist mask and the electrically conductive layer are at least partially covered by the solder material, and E) singulating the carrier plate and the electrically conductive layer along and through the solder resist mask and the solder material, wherein the solder material remains at least partially on the solder resist mask. |
申请公布号 |
US2016268186(A1) |
申请公布日期 |
2016.09.15 |
申请号 |
US201315029693 |
申请日期 |
2013.10.17 |
申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Lim Choo Kean;Chang Chee Jia;Or Choon Keat |
分类号 |
H01L23/498;H01L33/48;H01L21/48;H01L23/00 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Regensburg DE |