| 摘要 |
A polishing process involves a process for arranging a glass substrate and a carrier between a sun gear (40) and an internal gear (50), and a process for polishing the surface of the glass substrate by rotating the carrier in a state in which the outer periphery of the carrier meshes with tooth surfaces (42, 52). All tooth surfaces (42) and/or all tooth surfaces (52) include recesses (41, 51) having a shape recessed from the tooth tips, and the outer periphery of the carrier meshes with the recesses (41, 51) when the carrier rotates. Defining DC (unit: m) as the pitch circle diameter of the carrier and d (unit: mm) as the recess depth of the recesses (41, 51) from the tooth tips, the relation holds that 0.24 ≦̸ d/DC ≦̸ 1.89. |
