| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which deterioration in electrical insulation between an inspection electrode and a heat dissipating member is suppressed.SOLUTION: The semiconductor device includes: a circuit element (10); a substrate (20) on one surface (20a) of which the circuit element is mounted, wherein the mounted circuit element and wiring (22, 23) formed on and in the substrate constitute a circuit; an inspection electrode (30) which is formed on a rear surface (20b) opposite to the one surface of the substrate and is used to inspect the circuit; a heat dissipating member (40) for dissipating heat generated by the circuit element; and a fixing member (50) for fixing the substrate and the heat dissipating member. The rear surface of the substrate and the heat dissipating member face each other. The inspection electrode is formed in that region of the rear surface of the substrate which does not face the heat dissipating member. |
