| 摘要 |
PROBLEM TO BE SOLVED: To simultaneously solve problems of decrease in adhesive force, a turbid or coloring state of a cured product, and corrosion in wiring lines of a circuit board when an acrylic resin is compounded in an adhesive composition comprising an alicyclic epoxy compound and an acid anhydride for flip-chip bonding of a chip component.SOLUTION: An adhesive composition for flip-chip bonding of a chip component on a circuit board comprises an alicyclic epoxy compound, an alicyclic acid anhydride curing agent, and an acrylic resin. The content of the alicyclic acid anhydride curing agent is 80 to 120 parts by mass with respect to 100 parts by mass of an alicyclic epoxy compound; and the content of the acrylic resin is 5 to 50 parts by mass with respect to total 100 parts by mass of the alicyclic epoxy compound, the alicyclic acid anhydride curing agent, and the acrylic resin. The acrylic resin has a percentage of water absorption of 1.2% or less, which is prepared by copolymerizing an alkyl (meth)acrylate and 2 to 100 parts by mass of glycidyl methacrylate with respect to 100 parts by mass of the alkyl (meth)acrylate. |
