Wiring substrate, light emitting device, and manufacturing method of wiring substrate

摘要

There is provided a wiring substrate (1). The wiring substrate includes: a heat sink (10); an insulating layer (20) on the heat sink; a reflective layer (30) on the insulating layer; a wiring pattern (40) embedded in the reflective layer and including a first surface (40A), a second surface opposite to the first surface and a side surface, the second surface and the side surface contacting the reflective layer; and a metal layer (50) on the first surface of the wiring pattern, wherein an exposed surface (50A) of the metal layer is flush with an exposed surface of the reflective layer.