| 发明名称 |
INTERPOSER FOR A PACKAGE-ON-PACKAGE STRUCTURE |
| 摘要 |
A package-on-package (PoP) structure includes a first die, a second die, and a memory device electrically coupled to the first die and the second die by an interposer between the first die and the second die. The interposer includes copper-filled vias formed within a mold. |
| 申请公布号 |
WO2016200604(A1) |
申请公布日期 |
2016.12.15 |
| 申请号 |
WO2016US33948 |
申请日期 |
2016.05.24 |
| 申请人 |
QUALCOMM INCORPORATED |
发明人 |
LEE, Jae Sik;HWANG, Kyu-Pyung;WE, Hong Bok |
| 分类号 |
H01L25/065;H01L23/00;H01L23/14;H01L25/10 |
主分类号 |
H01L25/065 |
| 代理机构 |
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