| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition that reduces outgassing during a lamination process or after curing, provides a cured film having excellent weather resistance and light resistance and also excellent flexibility, and has a low shrinkage rate at the time of curing.SOLUTION: A photosensitive resin composition (D) comprises a self-polymerization type photopolymerizable compound (A) represented by general formula (1), a urethane (meth) acrylate compound (B), and a polymerizable compound (C) other than (B) as essential components (in the formula, R is a hydrogen atom or a methyl group).SELECTED DRAWING: None |
