| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding structure having at least one trench, capable of preventing impairment or flexure of the bonding structure by reducing bubbles or protrusions of an adhesive layer, and to provide a manufacturing method therefor and a die structure.SOLUTION: A bonding structure includes a first substrate 202, a second substrate 204, and an adhesive layer 208. The first substrate has a plurality of first trenches 22. The adhesive layer is installed between the first and second substrates, and the first trench is filled with the adhesive layer.EFFECT: Since the trench reduces bubbles or protrusions of the adhesive layer, impairment or flexure of the bonding structure can be prevented. Furthermore, since the trench is installed in a scribe line 20, design or occupied area of the wafer or carrier is not required to be changed.SELECTED DRAWING: Figure 9 |
