| 摘要 |
Provided is a semiconductor device, wherein a first semiconductor chip (10) has on a principal surface thereof a first terminal part (12) in which a plurality of terminals (11) are disposed, and a back surface of the chip is mounted on a front surface of a support (1). A second semiconductor chip (20) has on a principal surface thereof a second terminal part (22) in which a plurality of terminals (21) are disposed, the principal surface facing the principal surface of the first semiconductor chip (10), and the terminals (21) of the second terminal part (22) being respectively connected to the terminals (11) of the first terminal part (12). The first semiconductor chip (10) and external terminals (2) of the semiconductor device are connected by conductors (6, 7) comprising a single metal. |
