| 发明名称 |
TIM STRAIN MITIGATION IN ELECTRONIC MODULES |
| 摘要 |
A heat spreading lid including a lid body and a wing portion having a thermal interface material disposed on the wing portion such that the wing portion flexibly moves with the thermal interface material independently from the lid body. |
| 申请公布号 |
US2016365297(A1) |
申请公布日期 |
2016.12.15 |
| 申请号 |
US201615161496 |
申请日期 |
2016.05.23 |
| 申请人 |
International Business Machines Corporation |
发明人 |
McVicker Gerard;Sri-Jayantha Sri M. |
| 分类号 |
H01L23/367;H01L23/04 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat spreading lid, comprising:
a lid body; and a wing portion having a thermal interface material disposed on the wing portion such that the wing portion flexibly moves with the thermal interface material independently from the lid body. |
| 地址 |
Armonk NY US |
