THROUGH HOLE REFLOW SOLDERING DEVICE FOR B SURFACE SOCKET AND A SURFACE, AND SOCKET MOUNTING METHOD

摘要

Provided are a through hole reflow soldering device for a B surface socket and an A surface, and a socket mounting method. The device comprises: a feeding tray (1), a feeding tool (2), a positioning tool (3) and a reflow soldering tray (4). A socket (5) docks with the feeding tool (2) via the feeding tray (1), the feeding tool (2) docks with the positioning tool (3), and the positioning tool (3) snaps onto the reflow soldering tray (4).