| 摘要 |
PROBLEM TO BE SOLVED: To provide a target device, a sputtering apparatus, and a target member manufacturing method for suppressing peeling of deposited material.SOLUTION: A target device comprises a target member 51 which includes a first surface 51s and is conductive, and a non-target member 52 which includes a second surface 52s and is insulative. In the target device, the first surface 51s and the second surface 52s are in line with each other, the first surface 51s is a flat plane, and the second surface 52s includes level-difference planes. |
