| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for a mold process to achieve simplification of the manufacturing process and construction material and concurrently improve the flatness and reliability of a substrate.SOLUTION: An electronic component built-in multilayer wiring board includes: a multilayer wiring board formed by laminating first printed wiring boards; a first electronic component mounted on the multilayer wiring board; and a lamination body formed by second printed wiring boards laminated on the multilayer wiring board. The lamination body includes a first opening part which is closed at an upper side so as to seal the first electronic component mounted on the multilayer wiring board.SELECTED DRAWING: Figure 1 |
