| 摘要 |
PROBLEM TO BE SOLVED: To obtain a jig for manufacturing an electronic apparatus which is capable of stably arranging a foam solder at a predetermined position, and to obtain a manufacturing method of an electronic apparatus.SOLUTION: A positioning jig 4 has a rear surface contacting with the surface of a substrate 1, and a front surface facing the rear surface. In the positioning jig, a through hole 5 penetrating from the front surface to the rear surface is formed, a stepped part 6 is formed to an inner wall of the through hole 5, a suction nozzle 7 vacuum-suctions a foam solder 2 and places the foam solder 2 on the stepped part 6 in the through hole 5, and a bypass hole 9 is formed in a side of the suction nozzle 7.SELECTED DRAWING: Figure 1 |
