| 发明名称 |
Via in a printed circuit board |
| 摘要 |
A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole. |
| 申请公布号 |
US9398703(B2) |
申请公布日期 |
2016.07.19 |
| 申请号 |
US201414281802 |
申请日期 |
2014.05.19 |
| 申请人 |
Sierra Circuits, Inc. |
发明人 |
Karavakis Konstantine;Bahl Kenneth S. |
| 分类号 |
H05K1/03;H05K3/38;H05K3/42 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
Weller Douglas L. |
| 主权项 |
1. A printed circuit board, comprising:
dielectric laminate material in which has been drilled a hole, the dielectric laminate material being coated with a catalytic adhesive, catalytic adhesive also coating a portion of the dielectric laminate material around the hole, wherein the catalytic adhesive is a dielectric adhesive that includes catalytic filler particles composed of metal coated over silicon dioxide or kaolin; and, a patterned metal layer over the catalytic adhesive on both faces of the dielectric laminate material, including a portion of the patterned metal layer over the layer of catalytic adhesive that coats the portion of the dielectric laminate material around the hole. |
| 地址 |
Sunnyvale CA US |
