| 发明名称 | Manufacturing a product using a soldering process | ||
| 摘要 | Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path. Heating at least one of the solder paste beads by an electrical resistive heating, wherein the electrical resistive heating is generated by an electrical current flowing through the electrical conducting path. | ||
| 申请公布号 | US9398702(B2) | 申请公布日期 | 2016.07.19 |
| 申请号 | US201414282095 | 申请日期 | 2014.05.20 |
| 申请人 | INTERNATIONAL BUSINESS MACHINES CORPORATION | 发明人 | Chamberlin Bruce J.;Huber Andreas;Huels Harald;Winkel Thomas-Michael |
| 分类号 | H05K3/36;H05K3/34 | 主分类号 | H05K3/36 |
| 代理机构 | Heslin Rothenberg Farley & Mesiti P.C. | 代理人 | Chiu, Esq. Steven;Hulihan, Esq. Matthew M.;Heslin Rothenberg Farley & Mesiti P.C. |
| 主权项 | 1. A method of manufacturing a product, wherein the product comprises a first part and a second part, wherein the first part comprises solder pins and the second part comprises solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead, the method comprising: aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead; connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path; and heating at least one of the solder paste beads by an electrical resistive heating, wherein the electrical resistive heating is generated by an electrical current flowing through the electrical conducting path, wherein said solder paste bead undergoes a soldering process facilitated by the electrical resistive heating, wherein a temperature of said solder paste bead is being evaluated, wherein the electrical resistive heating is adjusted according to the temperature of said solder paste bead. | ||
| 地址 | Armonk NY US | ||