发明名称 SILVER-COATED COPPER POWDER AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a silver-coated copper powder excellent in storage stability (reliability) and to provide a method for producing the silver-coated copper powder.SOLUTION: A silver-coated copper powder produced by coating a surface of copper powder produced by an atomization method or the like with a silver-containing layer comprising 5 mass% or more (based on a silver-coated copper powder) of silver or a silver compound is added to a solution for supporting silver comprising a solution of silver potassium cyanide (or a silver potassium cyanide to which at least one kind selected from the group consisting of potassium pyrophosphate, boric acid, tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is added) to support 0.01 mass% or more (based on a silver-coated copper powder) of silver on the surface of the copper powder coated with the silver-containing layer.SELECTED DRAWING: Figure 1
申请公布号 JP2016130365(A) 申请公布日期 2016.07.21
申请号 JP20160000026 申请日期 2016.01.04
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 NOGAMI TOKUAKI;KAMIGA HIROSHI
分类号 B22F1/02;B22F1/00;C23C18/44;H01B1/00;H01B1/22;H01B5/00;H01B13/00 主分类号 B22F1/02
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