发明名称 FINE CIRCUIT BOARD AND ITS MANUFACTURING METHOD
摘要 The present invention relates to a circuit board having a microcircuit and a manufacturing method thereof. The present invention manufactures and uses a master mold on which the microcircuit is formed via a concave part and a convex part from an electroforming mold having the microcircuit formed via the concave part and the convex part. The master mold of the present invention is manufactured by a fluoroplastic material. According to the present invention, the concave part of the master mold is filled with silver paste, and the silver paste is hardened through a heating apparatus. Then, an epoxy resin is applied to the surface part of the convex part of the master mold and the exposed surface part of the hardened silver paste. A polyimide film is bonded to an upper part of the epoxy resin. After hardening the epoxy resin, the circuit board having a microcircuit is manufactured by separating the master mold. Thereby, the circuit board having a microcircuit can be manufactured by a simple method with excellent productivity.
申请公布号 KR20160085041(A) 申请公布日期 2016.07.15
申请号 KR20150001897 申请日期 2015.01.07
申请人 SEONG, NAK HOON 发明人 SEONG, NAK HOON
分类号 H05K3/10;H05K1/02 主分类号 H05K3/10
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