| 摘要 |
The present invention relates to a high-brightness LED package for a vehicle and a manufacturing method thereof and, more specifically, relates to a manufacturing method of a high-brightness LED package used as an LED headlamp for a vehicle. The LED package comprises: a metal printed circuit board (PCB); and a structure to prevent air voids formed in the metal PCB, having a pattern to discharge soldering gas during a soldering process, thus improving a durability of the LED package. |
