发明名称 可撓性基板処理装置の処理方法
摘要 To provide a flexible substrate processing apparatus which allows the stable reduction of an oxide contained in a film-like structure body formed on a flexible substrate. The apparatus has a substrate carrying-out portion where a flexible substrate on which a film-like structure body is formed is unwound; a reduction treatment portion where an oxide contained in the film-like structure body formed on the flexible substrate is electrochemically reduced; a washing portion where the flexible substrate and the film-like structure body are washed; a drying portion where the flexible substrate and the film-like structure body are dried; and a substrate carrying-in portion where the flexible substrate on which the film-like structure body is formed is taken up.
申请公布号 JP6045886(B2) 申请公布日期 2016.12.14
申请号 JP20120255766 申请日期 2012.11.22
申请人 株式会社半導体エネルギー研究所 发明人 高橋 実;齋藤 祐美子;桃 純平;森若 圭恵;楠本 直人
分类号 C25D9/08;C01B31/02;C23C20/06;H01M4/13;H01M4/139;H01M4/62 主分类号 C25D9/08
代理机构 代理人
主权项
地址
您可能感兴趣的专利