| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique that can improve performance by suppressing variation in performance for each flow sensor (including the case of improving performance by improving reliability).SOLUTION: For example, when a lead frame LF equipped with a semiconductor chip CHP1 is sandwiched between an upper mold UM and lower mold BM, a frame body FB and an elastic body film LAF are interposed between the lead frame LF equipped with the semiconductor chip CHP1 and the upper mold UM. In this case, the height of the frame body FB is higher than the height of a flow detection unit FDU and the elastic coefficient of the frame body FB is smaller than that of the semiconductor chip CHP1. |
