| 摘要 |
An integrated circuit (IC) assembly and related techniques are disclosed. The IC assembly (100) may include a first printed circuit board (PCB) (102) having a first face (104) and an opposing second face(106); a die (108) electrically coupled to the first face (104) of the first PCB (102); a second PCB (110) having a first face (112) and an opposing second face(114); and a molding compound(118). The second face (114) of the second PCB (110) is coupled to the first face (104) of the first PCB(102) via one or more solder joints (116). The molding compound (118) may be in contact with the first face (104) of the first PCB (102) and the second face (114) of the second PCB (11). |
