发明名称 半導体装置及び電子機器
摘要 The present technology relates to a semiconductor device and electronic equipment in which a semiconductor device that suppresses the occurrence of noise by a leakage of light can be provided. A semiconductor device is configured which includes a light-receiving element 34, an active element for signal processing, and a light shielding structure 40 which is between the light-receiving element 34 and the active element to cover the active element and is formed of wirings 45 and 46. The semiconductor device further includes a first substrate on which the light-receiving element is formed, a second substrate on which the active element is formed, and a wiring layer which has a light shielding structure by the wirings which is formed on the second substrate, and in which the second substrate can be bonded to the first substrate through the wiring layer.
申请公布号 JP6044847(B2) 申请公布日期 2016.12.14
申请号 JP20130556361 申请日期 2013.01.25
申请人 ソニー株式会社 发明人 小林 正治;工藤 義治;佐野 拓也
分类号 H01L27/14;H01L21/3205;H01L21/768;H01L23/522;H01L27/146;H04N5/357;H04N5/369 主分类号 H01L27/14
代理机构 代理人
主权项
地址