发明名称 リードフレームの製造方法
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a lead frame capable of preventing a steep rise in a manufacturing cost based on use of silver plating containing noble metal by suppressing silver plating usage during manufacturing as much as possible, with regard to a method for manufacturing a lead frame for an LED package.SOLUTION: A method for manufacturing a lead frame includes the steps of: creating a lead frame bar by forming a lead frame pattern on a metal bar; applying partial plating only to an upper surface of the lead frame in the lead frame bar; and applying highly-glossy silver plating to an upper surface of the partial plating and the whole surface of the lead frame bar.
申请公布号 JP6042701(B2) 申请公布日期 2016.12.14
申请号 JP20120250328 申请日期 2012.11.14
申请人 株式会社三井ハイテック 发明人 石橋 貴弘
分类号 H01L33/62 主分类号 H01L33/62
代理机构 代理人
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