METHOD FOR CHAMFERING/MACHINING BRITTLE MATERIAL SUBSTRATE AND CHAMFERING/MACHINING APPARATUS

摘要

A method for chamfering a brittle material substrate, according to which the chamfered surface is flat or bulges out is provided. The edge line (EL) where chamfering is to be carried out is irradiated with a laser beam so that the laser beam transmits through the substrate, and a condenser member (15) is provided along the path of the laser beam, and the focal point of the laser beam is on the surface or inside the substrate around the edge line. The focal point scans over the surface that meets the edge line at such a distance as to correspond to the width to which the substrate is to be chamfered, and chamfering is carried out along the path of the focal point through an ablation process around the focal point.