发明名称 |
Epoxy resin compound and radiant heat circuit board Using the same |
摘要 |
There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. |
申请公布号 |
EP2698400(A3) |
申请公布日期 |
2016.12.14 |
申请号 |
EP20130179967 |
申请日期 |
2013.08.09 |
申请人 |
LG Innotek Co., Ltd. |
发明人 |
Yun, Sung Jin;Lee, Hyuk Soo;Cho, In Hee;Park, Jae Man;Kim, Myeong Jeong;Yoon, Jong Heum;Park, Jeung Ook;Lee, Jong Sik;Gil, Gun Young;Giang, Thanh Kieu;Kim, Jin Hwan |
分类号 |
C08L63/00;C08G59/28;C08G59/30;C08K3/22;H05K1/03;H05K3/46 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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