| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing a wafer enabling the wafer to be easily peeled from a support member.SOLUTION: The method of processing a wafer comprises: a wafer pasting step in which, a resin R that cures due to external stimulation is applied on an upper surface S1 of a support member S, a wafer W is pressurized against and placed on the upper surface S1 and external stimulation is applied to the resin, so that the resin is cured; a thickness reducing step in which a rear surface of the wafer is ground, so that its thickness is reduced to be a prescribed thickness; a protective tape pasting step in which a protective tape is pasted on a rear surface W2 of the wafer; a scraper member inserting step in which two or more scraper members 6 each having a thick wall part 61 and an insert part 62 are inserted in an interface between the support member and the resin while the insert parts oriented toward a wafer center with a diameter of the wafer interposed between the insert parts; and a support member peeling step in which when a protective tape side is placed on a suction holding table 71 and the wafer is suction-held through the protective tape, a lower part of the thick wall part of the scraper member abuts on a suction-holding surface 71a through the protective tape, and at the same time, an upper part of the thick wall part push up the support member, so that the support member is peeled from the resin. |
