发明名称 SOLID-FILLED ENCAPSULATED LED BULB
摘要 A solid-filled encapsulated LED bulb (2) with a base (20), at least one LED light source (21) and at least one power supply element (22) includes a transparent solid-filled heat-dissipating light guide member (23) attached and covered onto the LED light source (21) and the power supply element (22). A side of the heat-dissipating light guide member (23) is packaged with the base (20) to form the LED bulb (2). The heat of the LED light source (21) is conducted and dissipated to the outside through the heat-dissipating light guide member (23). A light of the LED light source (21) is outputted with an intensity I A through the heat-dissipating light guide member (23). The intensity I A of the light and the intensity IB of the LED light source (21) satisfy the condition of (I A /I B )>70%. The use of a conventional dissipating structure is skipped to reduce the production cost and expedite the assembling and packaging processes while maintaining excellent heat dissipation and light output effects.
申请公布号 EP3104068(A1) 申请公布日期 2016.12.14
申请号 EP20150185722 申请日期 2015.09.17
申请人 Unity Opto Technology Co., Ltd. 发明人 WU, CHIH-HSIEN;TSAI, SEN-YUH;HUANG, CHUN-CHIEH;CHEN, YU-CHANG
分类号 F21V3/04;F21K99/00 主分类号 F21V3/04
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