发明名称 |
半導体のオーバーレイターゲットからオーバーレイを決定するシステム,その方法およびコンピュータプログラム |
摘要 |
Methods and apparatus for fabricating a semiconductor die including several target structures. A first layer is formed that includes one or more line or trench structures that extend in a first direction. A second layer is formed that includes one or more line or trench structures that extend in a second direction that is perpendicular to the first structure, such that a projection of the target structure along the first direction is independent of the second direction and a projection of the target structure along the second direction is independent of the first direction. A target structure and a method for generating a calibration curve are also described. |
申请公布号 |
JP6042396(B2) |
申请公布日期 |
2016.12.14 |
申请号 |
JP20140202977 |
申请日期 |
2014.10.01 |
申请人 |
ケーエルエー−テンカー コーポレイション |
发明人 |
レビンスキ・ブラディミル;アデル・マイケル・イー.;フロマー・アビブ;カンデル・ダニエル |
分类号 |
G03F9/00;G03F7/20;H01L21/66 |
主分类号 |
G03F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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