| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor device that can be mounted with more space-saving, and to provide a method of mounting the semiconductor device.SOLUTION: A mounting structure of a semiconductor device comprises: a wiring substrate 2 that has a wiring layer 7 formed above a part of a base 5 and a resist layer 8 formed above and on an insulating layer 6 and the wiring layer 7 so as to surround a plurality of pads of the wiring layer 7; a first bonding material 9 that is provided on one of the plurality of pads of the wiring substrate 2; a semiconductor device 3 that has a first electrode 3a and a second electrode 3b at the opposite surface side of the first electrode 3a and is provided so that the first bonding material 9 and the first electrode 3a are in contact with each other; a second bonding material 10 that is provided by electrically connecting the other of the plurality of pads; and a connection member 4 that is provided so as to contact a third bonding material 11 provided on the second electrode 3b of the semiconductor device 3. |
