| 摘要 |
<p>A substrate processing apparatus is provided to move vertically a receptacle for preventing the spray of chemicals by improving a structure thereof. A process chamber(210) is formed to process a substrate. A substrate supporting member is rotatably installed in the process chamber. The substrate is loaded on the substrate supporting member. A receptacle(230) is arranged to surround the periphery of the substrate supporting member. The receptacle is formed to prevent the spray of chemicals to be injected onto the substrate loaded on the substrate supporting member. A driving unit(240) supports both ends of the receptacle and moves vertically the receptacle in order to disperse a load caused by self weight of the receptacle.</p> |
