| 摘要 |
Patent Document 1 discloses height measurement using an atomic force microscope (AFM) as means for measuring micro roughness. However, since it takes time for this measurement, it is difficult to apply a single display to inspection of all wafers and the entire surface thereof in an in-line manner. The invention provides a technique that estimates micro roughness from a total sum of detection signals from plural detection systems and signal ratios, using a light scattering method. The technique rotates and translates a wafer at high speed to measure the entire surface of the wafer with high throughput. Further, the relationship between the micro roughness and the intensity of scattered light varies according to a material of the wafer and a film thickness thereof. Further, calibration of an apparatus is also necessary. In consideration of this point, the invention provides a technique that has a function of correcting an optically acquired detection result using a sample which is substantially the same as a measurement target and makes the optically acquired detection result come close to a result measured by an apparatus (for example, an AFM) using a different measurement principle. |
