| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure of a lead terminal and a circuit board capable of overlapping an existing heat dissipation member on the circuit board while improving a heat dissipation property, a circuit configuration body and an electric connection box.SOLUTION: In a connection structure of a lead terminal 14 of an electronic component 12 and a circuit board 15, the lead terminal 14 is inserted into a through hole 18 which is provided to communicate to a conducting path of the circuit board 15, and the lead terminal 14 and the conducting path of the circuit board 15 are soldered. The circuit board 15 includes: a plate part 16 in the shape of plate; and an expansion part 17 expanded from a surface of the plate part 16 around the through hole 18. The lead terminal 14 inserted into the through hole 18 is soldered to the circuit board 15 in such a manner that a distal end of the lead terminal 14 is positioned within the through hole 18 penetrating the plate part 16 and the expansion part 17. A flat surface of a heat dissipation member 26 in which a region corresponding to the through hole 18 is flattened, is overlapped on a surface of the circuit board 15 opposite to the surface where the expansion part 17 is expanded. |
