| 摘要 |
PROBLEM TO BE SOLVED: To apply a dicing tape for support to a wafer rear face with good accuracy in a process of manufacturing a mount frame by applying the dicing tape for support from a ring frame across the wafer rear face.SOLUTION: In a semiconductor wafer mounting method, a gas is supplied by a gas supply part 29 from a space between an inner edge of a ring frame f and an outer edge of a wafer W; the gas is circulated into between a dicing tape DT arranged opposite to a rear face of the wafer W and the wafer W; and rolling an application roller 41 on the dicing tape DT which is kept away from the rear face of the wafer W at a certain distance by the gas to apply the dicing tape to the rear face of the wafer W. |
