| 摘要 |
An electrostatic chuck for a semiconductor fabricating apparatus is provided to improve deposition/etch uniformity by forming a wing under the upper plate of an electrostatic chuck and by flowing sub cooling gas from the lower plate of the electrostatic chuck so that the upper plate is rotated by the sub cooling gas. An electrostatic chuck(200) is prepared whose upper and lower portions are separated from each other. The upper portion includes upper and lower plates(212,213). A connection groove(216) of a pipe type into which cooling gas is introduced from the outside is formed in the lower center portion of the lower plate and a cooling line through which the cooling gas introduced through the connection groove flows is formed in the upper surface of the lower plate. The upper plate is coupled to the upper surface of the lower plate, and a plurality of holes from which the cooling gas introduced into the cooling line of the lower plate flows are formed in the upper plate. The lower portion includes a fix plate(222) fixed to the bottom of a semiconductor fabricating apparatus and a connection line(224) connected to the connection groove. The fix plate is electrically connected to an apparatus(232) for generating electrostatic force, and the connection line has a pipe type through which the cooling gas is introduced. The upper and lower portions can be attached/detached to/from each other, capable of being detachably attached to a semiconductor substrate.
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