| 摘要 |
The present invention is related to A method for bonding elements (1,1') comprising the steps of
- producing on a main surface of a first element a first solder ball (3),
- producing on a main surface of a second element a second solder ball (3'),
- providing contact between said first solder ball (3) and said second solder ball (3'),
- bonding said first element (1) and said second element (1') by applying a reflow step whereby said solder balls melt and form a joined solder ball structure (7)
wherein
- prior to the bonding step, the first solder ball (3)is laterally embedded in a layer (4) of non-conductive material, such that the upper part of said first solder ball is not covered by said non-conductive material, and
- said layer (4) of non-conductive material is laterally embedding said first solder ball (3) up to a level parallel to the main surface of the first element. |
