| 摘要 |
A substrate processing method is provided to remove unnecessary resist from the surface of a substrate by eliminating hardened resist on the center portion and the peripheral portion of a wafer. A substrate(W) is gripped by a substrate gripping unit in a substrate gripping process. Resist stripper is supplied to the center part of the surface of the substrate gripped by the substrate gripping unit in a resist stripper supply process. An organic solvent liquid is supplied to the peripheral part of the surface of the substrate gripped by the substrate gripping unit in an organic solvent supply process. While the organic solvent supply process is performed, protection fluid is supplied to the center part of the surface of the substrate gripped by the substrate gripping unit in order to protect the center part of the substrate from the organic solvent.
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