| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit connecting component that enables connection in seconds to hours at 100-130°C and can prevent an expansion of a substrate due to heat.SOLUTION: The circuit connecting component includes: an adhesive composition containing an oxetane compound and an epoxy resin; and conductive particles, wherein the oxetane compound has two to four oxetane ring in its molecule. The circuit connecting component is formed between electrodes facing each other, which are respectively provided on two circuit substrates, and is a film used for obtaining the electrical connection of both electrodes and the adhesion of the two circuit substrates through heating and pressing. |
