| 摘要 |
PROBLEM TO BE SOLVED: To perform heat radiation/cooling on an integrated circuit in spite of a simple structure where the number of parts or assembly person-hours is reduced and which is neither large-sized nor made heavy, to make the heat unlikely to be conducted to an imaging device, and further, to maintain a strength of an overall apparatus.SOLUTION: A packing 9 is used in an electronic apparatus in which an imaging device 42 and integrated circuits 71, 72, 73 are accommodated in casings 1, 2, 4, which are different accommodation spaces neighboring to each other, and held between the imaging device and the integrated circuits by fitting sections of the casings 1, 2. The packing 9 is comprised of a composite body including a heat radiation part 91 formed annularly of a material having heat conductivity and packing parts 92 provided on front and rear sides of the heat radiation part 91 and formed annularly of a material of which the heat conductivity is lower than that of the heat radiation part 91. In most portions of the packing 9, the heat radiation part 91 is positioned at an outer peripheral side of the packing parts 92, and in a portion where the imaging device 42 and the integrated circuits 71, 72, 73 are proximate most, heat insulation parts 93 are provided which are formed integrally while being continued to the respective packing parts 92 on the front and rear sides, and positioned at a further outer peripheral side of the heat radiation part 91. |
