发明名称 基板回収装置
摘要 PROBLEM TO BE SOLVED: To provide a substrate recovery apparatus for recovering a substrate by puncturing the substrate with a needle with optimum conditions in any cases, without being affected by a state of a sheet.SOLUTION: A substrate recovery apparatus 1 comprises: a plurality of substrates 2 having conducting properties; a sheet member 3 having insulating properties, on a surface of which the substrates 2 are attached; a stage 4 that holds the sheet member 3 in a substantially horizontal direction with the substrates 2 facing the downward direction; a plurality of needle members 8 having conducting properties and each having a needle point 8a capable of puncturing the sheet member 3; a drive section 10 that holds the needle members 8 with the needle points 8a facing the downward direction above the stage 4 and moves the needle members 8 in a longitudinal direction; and a conduction detecting section 6 that detects conduction among the needle members 8. The needle points 8a of the needle members 8 are arranged within an area smaller than a surface of one of the substrates 2 that is attached on the sheet member 3 on the substantially the same plane crossing in the longitudinal direction. The drive section 10 makes the needle members 8 kept insulated from each other.
申请公布号 JP6042748(B2) 申请公布日期 2016.12.14
申请号 JP20130039289 申请日期 2013.02.28
申请人 オリンパス株式会社 发明人 船崎 純
分类号 G01N1/28 主分类号 G01N1/28
代理机构 代理人
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