发明名称 |
SYSTEM AND METHOD FOR PICKING AND PLACEMENT OF CHIP DIES |
摘要 |
According to an aspect of the invention, there is provided a chip die 2 manipulator apparatus arranged for picking and placing of a chip die 2 in a chip manufacturing process, wherein an imaging system 11 comprising an arc form convex spherical mirror 13 arranged at a second off-axis position B and centered relative to the centre position 5; a folding mirror 14 arranged in a light path between the convex spherical mirror 13 and the centre position 5 for folding the light path to a third off-axis position C; and an arc form concave spherical mirror 15 arranged at the third off-axis position C having a curvature to image from at least one of the centre position 5 and the component 2 on the image detection system 9. The imaging system 11 corrects for the angled image detection of the centre position 5. |
申请公布号 |
EP2521635(B1) |
申请公布日期 |
2016.12.14 |
申请号 |
EP20110713530 |
申请日期 |
2011.01.06 |
申请人 |
Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO |
发明人 |
VAN ZWET, Erwin John;VAN DOOREN, Léon;VERMEER, Adrianus Johannes Petrus Maria;MODDEMEIJER, Kees |
分类号 |
B25J9/16;G05B19/401;H01L21/68;H05K13/04 |
主分类号 |
B25J9/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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