| 摘要 |
Disclosed is an LED flip chip (1) solid crystal conductive adhesive structure, comprising an LED flip chip (1) and an electronic circuit board (3), wherein an LED flip chip cathode (5), an LED flip chip non-metal region (8) and an LED flip chip anode (4) are sequentially arranged on a lower surface of the LED flip chip (1) from left to right; a circuit board cathode (7), a circuit board non-metal region (9) and a circuit board anode (6) are sequentially arranged on an upper surface of the electronic circuit board (3) from left to right; the LED flip chip (1) and the electronic circuit board (3) are fixedly connected via thermosetting solid crystal insulation adhesive glue (2) which is adhered between the LED flip chip non-metal region (8) and the circuit board non-metal region (9); and the LED flip chip anode and cathode (4, 5) are respectively conductively connected to the electronic circuit board anode and cathode (6, 7) through direct metal-to-metal contact. Also disclosed is a mounting method for an LED flip chip solid crystal conductive adhesive structure, which has the advantages of a simple process, few operation procedures, low device investment, low production and processing cost, high production efficiency and easy implementation of large-scale and automatic production. |
