发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD, ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an inexpensive wiring board and its manufacturing method, an electronic component and its manufacturing method, a circuit board, and electronic equipment. <P>SOLUTION: A wiring board includes: a first substrate 10 which has an electronic element mounting area 14 and on which a first wiring pattern 12 is formed; and a second substrate 20 which has an area 26 to which at least a part of the first substrate 10 is attached and an electronic element mounting area 24, and on which formed is a second wiring pattern 22 where the first wiring pattern 12 and the second wiring pattern 22 are electrically connected to each other. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007243207(A) 申请公布日期 2007.09.20
申请号 JP20070105802 申请日期 2007.04.13
申请人 SEIKO EPSON CORP 发明人 HASHIMOTO NOBUAKI
分类号 H01L25/18;H01L23/12;H01L23/538;H01L25/065;H01L25/07;H05K1/14;H05K1/18;H05K3/00;H05K3/36;H05K3/38;H05K3/40;H05K3/46 主分类号 H01L25/18
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