发明名称 PROTECTIVE FILM FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE AND COMPOSITE SHEET
摘要 Provided are: a protective film for semiconductors, which is capable of suppressing warp of a semiconductor chip without deteriorating the productivity and reliability; a semiconductor device which is provided with this protective film for semiconductors; and a composite sheet. A protective film 10 for semiconductors according to one embodiment of the present invention is provided with: a protective layer 11 that is configured from a non-conductive inorganic material; and an adhesive layer 12 that is provided on one surface of the protective layer 11. The protective layer 11 contains at least a vitreous material, and is typically configured of a glass sheet. Consequently, warp of a semiconductor element, which is an object to be protected, is able to be effectively suppressed.
申请公布号 WO2016194893(A1) 申请公布日期 2016.12.08
申请号 WO2016JP65992 申请日期 2016.05.31
申请人 LINTEC CORPORATION 发明人 OKAMOTO, Naoya;IKEDA, Ryohei;HORIGOME, Katsuhiko
分类号 H01L23/00;H01L21/301;H01L21/60;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L23/00
代理机构 代理人
主权项
地址