发明名称 |
PROTECTIVE FILM FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE AND COMPOSITE SHEET |
摘要 |
Provided are: a protective film for semiconductors, which is capable of suppressing warp of a semiconductor chip without deteriorating the productivity and reliability; a semiconductor device which is provided with this protective film for semiconductors; and a composite sheet. A protective film 10 for semiconductors according to one embodiment of the present invention is provided with: a protective layer 11 that is configured from a non-conductive inorganic material; and an adhesive layer 12 that is provided on one surface of the protective layer 11. The protective layer 11 contains at least a vitreous material, and is typically configured of a glass sheet. Consequently, warp of a semiconductor element, which is an object to be protected, is able to be effectively suppressed. |
申请公布号 |
WO2016194893(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
WO2016JP65992 |
申请日期 |
2016.05.31 |
申请人 |
LINTEC CORPORATION |
发明人 |
OKAMOTO, Naoya;IKEDA, Ryohei;HORIGOME, Katsuhiko |
分类号 |
H01L23/00;H01L21/301;H01L21/60;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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