METHOD FOR PRODUCING A HOUSING COVER, METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT

摘要

The invention relates to a method for producing a housing cover comprising steps for providing a cover blank having a mounting surface formed on a bottom side, for connecting the bottom side of the cover blank to a silicon wafer, for creating at least one opening in the silicon wafer in order to expose at least part of the mounting surface, for arranging a base metallization on the exposed part of the mounting surface, and for removing the silicon wafer.