| 发明名称 |
CIRCUIT SUBSTRATE AND ELECTRONIC EQUIPMENT INCLUDING THE SAME |
| 摘要 |
A circuit substrate and an electronic equipment including the same are provided. The circuit substrate includes a build-up layer, a conductive pattern disposed on or within the build-up layer, a conductive via passing through the build-up layer and connected with the conductive pattern, and a dummy groove protruding into or passing through the build-up layer. |
| 申请公布号 |
US2016360609(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201615077711 |
申请日期 |
2016.03.22 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
LEE Chang-Bo |
| 分类号 |
H05K1/02;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit substrate comprising:
a build-up layer; a conductive pattern disposed on or within the build-up layer; a conductive via passing through the build-up layer and connected with the conductive pattern; and a dummy groove protruding into or passing through the build-up layer. |
| 地址 |
Suwon-si KR |
