Conical-Shaped or Tier-Shaped Pillar Connections

摘要

A pillar structure, and a method of forming, for a substrate is provided. The pillar structure may have one or more tiers, where each tier may have a conical shape or a spherical shape. In an embodiment, the pillar structure is used in a bump-on-trace (BOT) configuration. The pillar structures may have circular shape or an elongated shape in a plan view. The substrate may be coupled to another substrate. In an embodiment, the another substrate may have raised conductive traces onto which the pillar structure may be coupled.

主权项

1. A method of forming an connector, the method comprising:
forming a first mask, the first mask having a first opening over a conductive trace on a first substrate; forming a first tier in the first opening; forming a second mask over the first mask, the second mask having a second opening over the first tier; forming a second tier in the second opening; and removing the first mask and the second mask, each of the first tier and the second tier having a conical shape and a surface of an overlying tier has a smaller area in a plan view than an adjacent surface of a lower tier.