CONNECTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A connector structure and a manufacturing method thereof are provided. The connector structure includes a semiconductor substrate, a metal layer, a passivation layer, and a conductive structure. The metal layer is over the semiconductor substrate. The passivation layer is over the metal layer and includes an opening. The conductive structure is contacted with the metal layer in a patterned surface structure of the conductive structure through the opening of the passivation layer.

主权项

1. A connector structure, comprising:
a semiconductor substrate; a metal layer over the semiconductor substrate; a passivation layer over the metal layer and comprising an opening; and a conductive structure contacted with the metal layer in a patterned surface structure of the conductive structure through the opening of the passivation layer.