Calibration Kits for RF Passive Devices

摘要

A method includes measuring a first calibration kit in a wafer to obtain a first performance data. The wafer includes a substrate, and a plurality of dielectric layers over the substrate. The first calibration kit includes a first passive device over the plurality of dielectric layers, wherein substantially no metal feature is disposed in the plurality of dielectric layers and overlapped by the first passive device. The method further includes measuring a second calibration kit in the wafer to obtain a second performance data. The second calibration kit includes a second passive device identical to the first device and over the plurality of dielectric layers, and dummy patterns in the plurality of dielectric layers and overlapped by the second passive device. The first performance data and the second performance data are de-embedded to determine an effect of metal patterns in the plurality of dielectric layers to overlying passive devices.

主权项

1. A device comprising:
a chip comprising:
a substrate; anda plurality of dielectric layers over the substrate; a first calibration kit in the chip, wherein the first calibration kit comprises:
a first passive device over the plurality of dielectric layers; andfirst dummy patterns in the plurality of dielectric layers and overlapped by the first passive device, wherein the first dummy patterns are electrically floating; and a second calibration kit in the chip, wherein the second calibration kit comprises:
a second passive device over the plurality of dielectric layers, wherein the second passive device is identical to the first passive device, wherein each of the first and the second calibration kits comprises a probe pad connected to a respective one of the first passive device and the second passive device; andsecond dummy patterns in the plurality of dielectric layers and overlapped by the second passive device, wherein the second dummy patterns are electrically floating, and the first dummy patterns have a first layout different from a second layout of the second dummy patterns.